Startech.com - Computer Parts Metal Oxide Thermal Cpu Paste Compound Tube For Heatsink In Silvgrease1
[SILVGREASE1]

TEMPORARILY OUT OF STOCK


Part Number: SILVGREASE1

Manufacturer: startech.com

Condition: New

Short Description:

Startech.com - Computer Parts Silvgrease1 Metal Oxide Thermal Cpu Paste

Startech.com - Computer Parts    Metal Oxide Thermal Cpu Paste       Compound Tube For Heatsink       In Silvgrease1

£6.00
£7.20 - Inc VAT




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Provide optimal heat transfer between CPU and heatsink through a metal oxide compound

Our thermal CPU paste improves the effectiveness of CPU coolers by thermally bonding the CPU to the heatsink.

A high quality metallic solution that helps to ensure maximum dissipation of heat generated by the CPU for optimized performance and greater system stability; and is more effective than standard silicon-based heat grease/CPU paste, providing optimum protection against CPU heat damage.

The StarTech.com Advantage

- Better thermal conductivity over standard silicon-based compounds and negligible electrical conductivity for effective and safe use in high performance applications

Reviews

Specs

Technical details
Material Carbon, Silicone
Colour of product Silver
Packaging data
Package width 2 cm
Package depth 8.2 cm
Package height 15.3 cm
Other features
Package length 3.23 mm

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Features

StarTech.com 1.5g Metal Oxide Thermal CPU Paste Compound Tube for Heatsink. Package width: 2 cm, Package depth: 8.2 cm, Package height: 15.3 cm. Package length: 3.23 mm

Product Description

Provide optimal heat transfer between CPU and heatsink through a metal oxide compound

Our thermal CPU paste improves the effectiveness of CPU coolers by thermally bonding the CPU to the heatsink.

A high quality metallic solution that helps to ensure maximum dissipation of heat generated by the CPU for optimized performance and greater system stability; and is more effective than standard silicon-based heat grease/CPU paste, providing optimum protection against CPU heat damage.

The StarTech.com Advantage

- Better thermal conductivity over standard silicon-based compounds and negligible electrical conductivity for effective and safe use in high performance applications

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