Stock Status: 1x unit in stock
Performance Thermal Paste - 10g
Improve cooling performance in workstations, servers, and compact systems with this high-performance thermal paste, designed for efficient heat transfer and safe application in professional environments.
Reliable Thermal Transfer for Demanding Systems
Silicone-based thermal compound features a thermal conductivity of 14.5 W/m • K and an operating range of -58°F to +536°F (-50°C to +280°C); helping maintain thermal stability in CPUs, GPUs, and ICs with high TDP under continuous load.
Safe for Sensitive Components
Electrically non-conductive grease helps prevent shorts, supporting safe use in spaced constrained or critical system builds.
Precise and Reusable Application
Includes a resealable 10g syringe with screw cap and plunger for controlled, repeatable use in upgrades, repairs, or custom builds.
Specs
| Technical details |
| Compliance certificates |
RoHS |
| Weight & dimensions |
| Width |
26.6 mm |
| Depth |
126 mm |
| Height |
17.2 mm |
| Weight |
10 g |
| Packaging data |
| Quantity per pack |
1 pc(s) |
| Scraper |
Yes |
| Package width |
160 mm |
| Package depth |
60 mm |
| Package height |
30 mm |
| Package weight |
44 g |
| Logistics data |
| Master (outer) case width |
500 mm |
| Master (outer) case length |
330 mm |
| Master (outer) case height |
255 mm |
| Products per master (outer) case |
120 pc(s) |
| Features |
| Type |
Thermal paste |
| Thermal conductivity |
14.5 W/m·K |
| Constitutive ingredients |
Aluminium oxide, Silicone, Zinc oxide |
| Product colour |
Grey |
| Thermal resistance |
1.42 °C/W |
| Specific gravity |
2.65 g/cm³ |
| Operating temperature (T-T) |
-50 - 280 °C |
Features
StarTech.com High-Performance Silicone Thermal Paste, 14.5W/m•K Conductivity, Grease Compound for CPUs, GPUs, and ICs, Improves Heat Dissipation in Computers. Type: Thermal paste, Thermal conductivity: 14.5 W/m·K, Constitutive ingredients: Aluminium oxide, Silicone, Zinc oxide. Width: 26.6 mm, Depth: 126 mm, Height: 17.2 mm. Quantity per pack: 1 pc(s), Package width: 160 mm, Package depth: 60 mm. Master (outer) case width: 500 mm, Master (outer) case length: 330 mm, Master (outer) case height: 255 mm
Product Description
Performance Thermal Paste - 10g
Improve cooling performance in workstations, servers, and compact systems with this high-performance thermal paste, designed for efficient heat transfer and safe application in professional environments.
Reliable Thermal Transfer for Demanding Systems
Silicone-based thermal compound features a thermal conductivity of 14.5 W/m • K and an operating range of -58°F to +536°F (-50°C to +280°C); helping maintain thermal stability in CPUs, GPUs, and ICs with high TDP under continuous load.
Safe for Sensitive Components
Electrically non-conductive grease helps prevent shorts, supporting safe use in spaced constrained or critical system builds.
Precise and Reusable Application
Includes a resealable 10g syringe with screw cap and plunger for controlled, repeatable use in upgrades, repairs, or custom builds.
