Stock Status: 1x unit in stock
Our thermal CPU paste improves the effectiveness of CPU coolers by thermally bonding the CPU to the heatsink.
A high quality metallic solution that helps to ensure maximum dissipation of heat generated by the CPU for optimized performance and greater system stability; and is more effective than standard silicon-based heat grease/CPU paste, providing optimum protection against CPU heat damage.
Please see our support section for the Material Safety Data Sheet for SILVGREASE1.
The StarTech.com Advantage
- Better thermal conductivity over standard silicon-based compounds and negligible electrical conductivity for effective and safe use in high performance applications
Specs
| Technical details |
| Package length |
3.23 mm |
| Evaporation (@ 200°C/24h) |
0.001% |
| Bleed (@ 200°C/24h) |
0.05% |
| Sustainability certificates |
RoHS |
| Weight & dimensions |
| Depth |
67 mm |
| Weight |
10 g |
| Packaging data |
| Package width |
84 mm |
| Package depth |
151 mm |
| Package height |
25 mm |
| Package weight |
17 g |
| Features |
| Thermal conductivity |
1.93 W/m·K |
| Specific gravity |
1.7 g/cm³ |
| Product colour |
Silver |
| Thermal resistance |
0.12 °C/W |
| Operating temperature (T-T) |
-30 - 180 °C |
| RoHS compliance |
Y |
Features
StarTech.com 1.5g Metal Oxide Thermal CPU Paste Compound Tube for Heatsink. Thermal conductivity: 1.93 W/m·K, Product colour: Silver, Thermal resistance: 0.12 °C/W. Depth: 67 mm, Weight: 10 g. Package width: 84 mm, Package depth: 151 mm, Package height: 25 mm
Product Description
Our thermal CPU paste improves the effectiveness of CPU coolers by thermally bonding the CPU to the heatsink.
A high quality metallic solution that helps to ensure maximum dissipation of heat generated by the CPU for optimized performance and greater system stability; and is more effective than standard silicon-based heat grease/CPU paste, providing optimum protection against CPU heat damage.
Please see our support section for the Material Safety Data Sheet for SILVGREASE1.
The StarTech.com Advantage
- Better thermal conductivity over standard silicon-based compounds and negligible electrical conductivity for effective and safe use in high performance applications
